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	Die-bonding material for optical semiconductor devices and optical semiconductor device using same
	NISHIMURA, TAKASHI; WATANABE, TAKASHI
	2013-04-17
著作权人	SEKISUI CHEMICAL CO., LTD.
专利号	EP2581954A1
国家	欧洲专利局
文献子类	发明申请
其他题名	Die-bonding material for optical semiconductor devices and optical semiconductor device using same
英文摘要	The present invention provides a die bonding material for an optical semiconductor device which has high thermal conductivity and can prevent cracking in an optical semiconductor device including the die bonding material. The die bonding material for an optical semiconductor device includes: a first silicone resin containing a hydrogen atom bonded to a silicon atom, a second silicone resin not containing a hydrogen atom bonded to a silicon atom, but containing an alkenyl group, a catalyst for hydrosilylation reaction, and at least one substance selected from the group consisting of anhydrous magnesium carbonate represented by chemical formula MgCO3 not containing crystal water and coated bodies including the anhydrous magnesium carbonate and an organic resin, a silicone resin, or silica coated on the surface thereof.
公开日期	2013-04-17
申请日期	2011-06-07
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54241]
专题	半导体激光器专利数据库
作者单位	SEKISUI CHEMICAL CO., LTD.
推荐引用方式 GB/T 7714	NISHIMURA, TAKASHI,WATANABE, TAKASHI. Die-bonding material for optical semiconductor devices and optical semiconductor device using same. EP2581954A1. 2013-04-17.

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