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	Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package
	YAMAZAKI, TAKAO; SANO, MASAHIKO; KURASHINA, SEIJI; SOGAWA, YOSHIMICHI
	2011-05-19
著作权人	GODO KAISHA IP BRIDGE 1
专利号	US20110114840A1
国家	美国
文献子类	发明申请
其他题名	Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package
英文摘要	The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole.
公开日期	2011-05-19
申请日期	2009-01-28
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54069]
专题	半导体激光器专利数据库
作者单位	GODO KAISHA IP BRIDGE 1
推荐引用方式 GB/T 7714	YAMAZAKI, TAKAO,SANO, MASAHIKO,KURASHINA, SEIJI,et al. Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package. US20110114840A1. 2011-05-19.

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