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	Mounted Semiconductor Device And A Method For Making The Same
	WONG, ANDRE; BAJWA, SUKBHIR
	2009-01-08
著作权人	LUMENTUM OPERATIONS LLC
专利号	US20090008773A1
国家	美国
文献子类	发明申请
其他题名	Mounted Semiconductor Device And A Method For Making The Same
英文摘要	A method for mounting a semiconductor device onto a composite substrate, including a submount and a heat sink, is described. According to one aspect of the invention, the materials for the submount and the heat sink are chosen so that the value of coefficient of thermal expansion of the semiconductor device is in between the values of coefficients of thermal expansion of the materials of the submount and the heat sink, the thickness of the submount being chosen so as to equalize thermal expansion of the semiconductor device to that of the surface of the submount the device is mounted on. According to another aspect of the invention, the semiconductor device, the submount, and the heat sink are soldered into a stack at a single step of heating, which facilitates reduction of residual post-soldering stresses.
公开日期	2009-01-08
申请日期	2008-07-02
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54030]
专题	半导体激光器专利数据库
作者单位	LUMENTUM OPERATIONS LLC
推荐引用方式 GB/T 7714	WONG, ANDRE,BAJWA, SUKBHIR. Mounted Semiconductor Device And A Method For Making The Same. US20090008773A1. 2009-01-08.

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