| Thermosetting resin composition and photo-semiconductor encapsulant | |
| YOSHIKAWA, YUJI | |
| 2008-05-29 | |
| 著作权人 | SHIN-ETSU CHEMICAL CO., LTD. |
| 专利号 | US20080124822A1 |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Thermosetting resin composition and photo-semiconductor encapsulant |
| 英文摘要 | A method of encapsulating a photo-semiconductor device using a thermosetting resin composition comprising (A) a silicone compound containing at least two epoxy groups per molecule and having a molecular weight of 500-2, 100, (B) an acid anhydride, and (C) an optional catalyst, which cures into a low-stressed product having improved adhesion, heat resistance and moisture resistance and being free of cure shrinkage. |
| 公开日期 | 2008-05-29 |
| 申请日期 | 2008-01-22 |
| 状态 | 失效 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53995]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SHIN-ETSU CHEMICAL CO., LTD. |
| 推荐引用方式 GB/T 7714 | YOSHIKAWA, YUJI. Thermosetting resin composition and photo-semiconductor encapsulant. US20080124822A1. 2008-05-29. |
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