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	Encapsulating and transferring low dimensional structures
	DAY, STEPHEN; ALTEBAEUMER, THOMAS HEINZ-HELMUT; HEFFERNAN, JONATHAN
	2010-01-21
著作权人	SHARP KABUSHIKI KAISHA
专利号	US20100012180A1
国家	美国
文献子类	发明申请
其他题名	Encapsulating and transferring low dimensional structures
英文摘要	A method of encapsulating low dimensional structures comprises forming a first group (3a) of low dimensional structures (1) and a second group (3b) of low dimensional structures (1) on a first substrate. The first group (3a) of low dimensional structures (1) and the second group (3b) of low dimensional structures (1) are encapsulated in a matrix (5), with the first group (3a) of low dimensional structures (1) being encapsulated separately from the second group (3b) of low dimensional structures (1). After encapsulation, the first group (3a) of low dimensional structures (1) may be separated from the second group (3b) of low dimensional structures (1). Each group may then be processed, for example by transfer to a second substrate (7). The number of low dimensional structures in a group, and the aspect ratio of a group is defined when the low dimensional structures are formed, and can therefore be controlled more accurately than in a conventional method in which groups are defined using a patterning technique.
公开日期	2010-01-21
申请日期	2007-10-11
状态	申请中
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53969]
专题	半导体激光器专利数据库
作者单位	SHARP KABUSHIKI KAISHA
推荐引用方式 GB/T 7714	DAY, STEPHEN,ALTEBAEUMER, THOMAS HEINZ-HELMUT,HEFFERNAN, JONATHAN. Encapsulating and transferring low dimensional structures. US20100012180A1. 2010-01-21.

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