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	Diode laser component with an integrated cooling element
	TREUSCH, GEORG; SRINIVASAN, RAMAN; MILLER, ROBERT
	2006-11-23
著作权人	SPECTRA-PHYSICS CORPORATION
专利号	US20060262819A1
国家	美国
文献子类	发明申请
其他题名	Diode laser component with an integrated cooling element
英文摘要	A laser component having an integrated cooling element is disclosed herein and includes a multiple layer heatsink body having a first isolation layer, at least a second isolation layer, and a micro-channel body positioned between the first and second isolation layers, the micro-channel body having one or more micro-channels formed therein in communication with a first passage and at least a second passage, at least one cathode lead formed on a first surface of the heatsink body, at least one anode lead formed on a first surface of the heatsink body, a coupling surface formed on a second surface of the heatsink body, at least one conduit traversing the heatsink body, the conduit in electrical communication with the anode lead and the coupling surface, a coolant source in fluid communication with the micro-channels formed in the micro-channel body through the first and second passages, at least one operational element positioned on the first surface of the heatsink body in communication with the cathode lead and anode lead.
公开日期	2006-11-23
申请日期	2006-05-04
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53799]
专题	半导体激光器专利数据库
作者单位	SPECTRA-PHYSICS CORPORATION
推荐引用方式 GB/T 7714	TREUSCH, GEORG,SRINIVASAN, RAMAN,MILLER, ROBERT. Diode laser component with an integrated cooling element. US20060262819A1. 2006-11-23.

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