| Submount for light emitting device | |
| KIM, HYUNG-KUN; CHAE, SU-HEE; JANG, TAE-HOON | |
| 2006-11-09 | |
| 著作权人 | SAMSUNG ELECTRONICS CO., LTD. |
| 专利号 | US20060249744A1 |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Submount for light emitting device |
| 英文摘要 | A submount for a light emitting device package is provided. The submount includes a substrate; a first bonding layer and a second bonding layer which are separately formed on the substrate; a first barrier layer and a second barrier layer which are formed on the first bonding layer and on the second bonding layer, respectively; a first solder and a second solder which are formed on the first barrier layer and on the second barrier layer, respectively; and a first blocking layer and a second blocking layer which are formed around the first barrier layer and the second barrier layer, blocking the melted first solder and the melted second solder from overflowing during a flip chip process. |
| 公开日期 | 2006-11-09 |
| 申请日期 | 2006-03-10 |
| 状态 | 失效 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53778]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SAMSUNG ELECTRONICS CO., LTD. |
| 推荐引用方式 GB/T 7714 | KIM, HYUNG-KUN,CHAE, SU-HEE,JANG, TAE-HOON. Submount for light emitting device. US20060249744A1. 2006-11-09. |
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