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	Light-emitting-diode packaging structure having thermal-electric element
	YU, CHIH-KUANG; LIU, CHUN-KAI; TAIN, RA-MIN; CHENG, JEN-HAU
	2007-01-18
著作权人	INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
专利号	US20070012938A1
国家	美国
文献子类	发明申请
其他题名	Light-emitting-diode packaging structure having thermal-electric element
英文摘要	A light-emitting-diode packaging structure having thermoelectric device, which is applied to the LED unit packaged using the flip chip technology. This is realized by directly building the thermoelectric elements into the solder bump layer of the light-emitting-diode packaging structure to replace a part of the solder bumps, as such raising the heat dissipation efficiency of the light emitting diode unit, enhancing the stability and reliability of light emission of the LED unit, and reducing the difficulties and complexity of the integration of the LED package.
公开日期	2007-01-18
申请日期	2005-10-24
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53738]
专题	半导体激光器专利数据库
作者单位	INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
推荐引用方式 GB/T 7714	YU, CHIH-KUANG,LIU, CHUN-KAI,TAIN, RA-MIN,et al. Light-emitting-diode packaging structure having thermal-electric element. US20070012938A1. 2007-01-18.

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