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	Optoelectronic arrangement having a surface-mountable semiconductor module and a cooling element
	WEIGERT, MARTIN
	2006-03-02
著作权人	FINISAR CORPORATION
专利号	US20060045413A1
国家	美国
文献子类	发明申请
其他题名	Optoelectronic arrangement having a surface-mountable semiconductor module and a cooling element
英文摘要	An optoelectronic arrangement having a surface-mountable semiconductor module having at least one optoelectronic transmitting and/or receiving unit, a housing, in which the optoelectronic transmitting and/or receiving unit is arranged, and a mounting side of the housing, which, in the case of surface mounting of the semiconductor module on a printed circuit board, faces the printed circuit board. The arrangement furthermore has a cooling element, which is thermally coupled to the semiconductor module for the purpose of cooling the optoelectronic transmitting and/or receiving unit. The cooling element is arranged on a side of the housing that is remote from the mounting side.
公开日期	2006-03-02
申请日期	2005-02-09
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53551]
专题	半导体激光器专利数据库
作者单位	FINISAR CORPORATION
推荐引用方式 GB/T 7714	WEIGERT, MARTIN. Optoelectronic arrangement having a surface-mountable semiconductor module and a cooling element. US20060045413A1. 2006-03-02.

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