QQ客服 官方微博 反馈留言

	Light emitting device, package structure thereof and manufacturing method thereof
	PARK, BYOUNG JAE
	2004-11-25
著作权人	NANO PACKAGING TECHNOLOGY, INC.
专利号	WO2004102685A1
国家	世界知识产权组织
文献子类	发明申请
其他题名	Light emitting device, package structure thereof and manufacturing method thereof
英文摘要	Provided are an light emitting device, a package structure thereof and a method of manufacturing the same, in which a light emitting efficiency and a heat dissipating capability can be increased, by mounting an LED chip to a main substrate for heat dissipation, made of a metal and having a large area are provided. The light emitting device package structure includes a main substrate for heat dissipation, including a reflecting mirror having an inner space whose an upper part is open and which is formed by a side wall protruding a predetermined height upward between an edge and a middle portion of the main substrate, the middle portion being where a light emitting device chip is to be mounted, an auxiliary circuit board which is interposed between the edge and the side wall of the main substrate, the auxiliary circuit board having a bottom surface partially being exposed to the main substrate, and which has at least one conductive pad formed on the exposed bottom surface and a chip bonding pad electrically connected to the conductive pad formed on a surface exposed upward, and a lead frame which is adhered to the conductive pad.
公开日期	2004-11-25
申请日期	2004-05-13
状态	未确认
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53329]
专题	半导体激光器专利数据库
作者单位	NANO PACKAGING TECHNOLOGY, INC.
推荐引用方式 GB/T 7714	PARK, BYOUNG JAE. Light emitting device, package structure thereof and manufacturing method thereof. WO2004102685A1. 2004-11-25.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。