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	Boiling temperature design in pumped microchannel cooling loops
	ZHOU, PENG; ZENG, SHULIN; KENNY, THOMAS, W., JR.; MUNCH, MARK; UPADHYA, GIRISH; GOODSON, KENNETH; SANTIAGO, JUAN, G.
	2004-09-30
著作权人	COOLIGY, INC.
专利号	WO2004083742A2
国家	世界知识产权组织
文献子类	发明申请
其他题名	Boiling temperature design in pumped microchannel cooling loops
英文摘要	A method of cooling at least one heat generating device (220) using a cooling system (200) is disclosed. The method comprises the steps of using at least one pump (240) to cause a fluid to flow in at least on heat exchanger (210) and adjusting a pressure of the fluid to correspondingly adjust a boiling point temperature of the fluid in the at least one heat exchanger. The method can also include the step of providing at least one heat rejector (230) for rejecting heat from the system, the at least one heat rejector being situated downstream of the at least one heat exchanger. The step of adjusting a pressure of the fluid can comprise adjusting a pressure of the fluid during charging and sealing of the system. Further, the step of adjusting a pressure of the fluid can comprise adjusting a composition and volume of a gas and liquid introduced during charging of the system.
公开日期	2004-09-30
申请日期	2004-03-05
状态	未确认
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53274]
专题	半导体激光器专利数据库
作者单位	COOLIGY, INC.
推荐引用方式 GB/T 7714	ZHOU, PENG,ZENG, SHULIN,KENNY, THOMAS, W., JR.,et al. Boiling temperature design in pumped microchannel cooling loops. WO2004083742A2. 2004-09-30.

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