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	Methods of assembling leadless packages for image sensor devices
	BOON, SUAN JEUNG; CHIA, YONG POO; NEO, YONG LOO; CHUA, SWEE KWANG; LOW, SIU WAF
	2004-05-06
著作权人	MICRON TECHNOLOGY, INC.
专利号	US20040084741A1
国家	美国
文献子类	发明申请
其他题名	Methods of assembling leadless packages for image sensor devices
英文摘要	A leadless image sensor package and methods for its assembly. In a first embodiment, an image sensor chip is mounted within a bottom-side cavity of a package shell in a flip-chip manner such that sensing circuitry on the image sensor chip is exposed through an aperture in the top side of the package shell. A transparent encapsulant material is deposited within the aperture to encase interconnect bonds between the package shell and the image sensor chip. A transparent lid is held in place over the aperture by the encapsulant material. The back surface of the image sensor chip is left exposed. In a second embodiment particularly suitable for high-end image sensors, an encapsulant material is not required. Instead, a backing cap is hermetically sealed to a ledge surface in the package shell to cover the bottom-side cavity. A compression member formed on the backing cap contacts the image sensor chip and maintains interconnect bond integrity.
公开日期	2004-05-06
申请日期	2003-10-23
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53167]
专题	半导体激光器专利数据库
作者单位	MICRON TECHNOLOGY, INC.
推荐引用方式 GB/T 7714	BOON, SUAN JEUNG,CHIA, YONG POO,NEO, YONG LOO,et al. Methods of assembling leadless packages for image sensor devices. US20040084741A1. 2004-05-06.

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