Formation of dendritic nanostructures in Pyrex glass anodically bonded to silicon coated with an aluminum thin film | |
Hu YQ(胡宇群)![]() ![]() ![]() | |
2008 | |
会议名称 | 14th International Conference on the Strength of Materials (ICSMA 14) |
会议日期 | JUN 04-09, 2006 |
通讯作者邮箱 | yzhao@lnm.imech.ac.cn |
会议地点 | Xian Jiaotong Univ, Xian, PEOPLES R CHINA |
关键词 | Anodic Bonding Dendritic Nanostructures Aluminum Thin Film Depletion Layer Mems Ion Drift Processes Borosilicate Glass Depletion |
页码 | 611-616 |
通讯作者 | Zhao YP |
中文摘要 | Anodic bonding with thin films of metal or alloy as an intermediate layer, finds increasing applications in micro/nanoelectromechanical systems. At the bonding temperature of 350 degrees C, voltage of 400 V, and 30 min duration, the anodic bonding is completed between Pyrex glass and crystalline silicon coated with an aluminum thin film with a thickness comprised between 50 and 230 nm. Sodium-depleted layers and dendritic nanostructures were observed in Pyrex 7740 glass adjacent to the bonding interface. The sodium depletion width does not increase remarkably with the thickness of aluminum film. The dendritic nanostructures result from aluminum diffusion into the Pyrex glass. This experimental research is expected to enhance the understanding of how the depletion layer and dendritic nanostructures affect the quality of anodic bonding. (C) 2007 Elsevier B.V. All rights reserved. |
收录类别 | CPCI-S |
会议录 | Materials Science And Engineering A-Structural Materials Properties Microstructure And Processing
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会议录出版者 | Lausanne |
会议录出版地 | Elsevier Science Sa |
语种 | 英语 |
ISSN号 | 0921-5093 |
WOS记录号 | WOS:000256071100154 |
内容类型 | 会议论文 |
源URL | [http://dspace.imech.ac.cn/handle/311007/25436] ![]() |
专题 | 力学研究所_力学所知识产出(1956-2008) |
通讯作者 | Zhao YP |
推荐引用方式 GB/T 7714 | Hu YQ,Zhao YP,Yu TX,et al. Formation of dendritic nanostructures in Pyrex glass anodically bonded to silicon coated with an aluminum thin film[C]. 见:14th International Conference on the Strength of Materials (ICSMA 14). Xian Jiaotong Univ, Xian, PEOPLES R CHINA. JUN 04-09, 2006. |
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