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	Multi-layer PCB and method for coupling block type multichannel optical signals
	KIM, YOUNG-WOO; RHEE, BYOUNG-HO; YANG, DEK-GIN; CHO, YOUNG-SANG; YIM, KYU-HYOK
	2004-06-10
著作权人	SAMSUNG ELECTRO-MECHANICS CO LTD
专利号	US20040109627A1
国家	美国
文献子类	发明申请
其他题名	Multi-layer PCB and method for coupling block type multichannel optical signals
英文摘要	The present invention discloses a multi-layer Printed Circuit Board (PCB) and method for coupling block type multichannel optical signals, the method including the steps of i) forming one or more first optical via holes to allow one or more first optical signal coupling blocks to be inserted therein, ii) aligning a first optical waveguide and the first optical signal coupling blocks so that the first optical waveguide is interconnected to the first optical signal coupling blocks via an optical signal, iii) attaching a first fixing guide to a base board to fasten the first optical signal coupling blocks, iv) removing the first fixing guide and forming one or more second optical via holes to allow one or more second optical signal coupling blocks to be inserted therein, and v) repeatedly performing steps i) to iv) as many times as a number of layers of the multi-layer PCB.
公开日期	2004-06-10
申请日期	2003-04-16
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53003]
专题	半导体激光器专利数据库
作者单位	SAMSUNG ELECTRO-MECHANICS CO LTD
推荐引用方式 GB/T 7714	KIM, YOUNG-WOO,RHEE, BYOUNG-HO,YANG, DEK-GIN,et al. Multi-layer PCB and method for coupling block type multichannel optical signals. US20040109627A1. 2004-06-10.

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