Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board | |
KIM, YOUNG-WOO; RHEE, BYOUNG-HO; YANG, DEK-GIN; CHO, YOUNG-SANG; YIM, KYU-HYOK | |
2004-06-10 | |
著作权人 | SAMSUNG ELECTRO-MECHANICS CO LTD |
专利号 | US20040109628A1 |
国家 | 美国 |
文献子类 | 发明申请 |
其他题名 | Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board |
英文摘要 | Disclosed herein is an optical signal coupling block, and a multi-layer printed circuit board and the method for coupling optical signals between layers of a multi-layer printed circuit board (PCB) using optical signal coupling blocks. The optical signals between the layers are coupled through the steps of forming a plurality of optical via holes in the multi-layer PCB to which optical waveguides for transmitting optical signals are attached; inserting the optical signal coupling blocks into the plural optical via holes such that the optical signal coupling blocks are connected to the optical waveguides to transmit the optical signals; forming at least one connection part to couple optical signals between the optical waveguides and the optical signal coupling blocks; and interconnecting the optical waveguides and the optical signal coupling blocks by aligning positions of the optical waveguides and the optical signal coupling blocks. |
公开日期 | 2004-06-10 |
申请日期 | 2003-04-16 |
状态 | 失效 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/53000] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | SAMSUNG ELECTRO-MECHANICS CO LTD |
推荐引用方式 GB/T 7714 | KIM, YOUNG-WOO,RHEE, BYOUNG-HO,YANG, DEK-GIN,et al. Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board. US20040109628A1. 2004-06-10. |
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