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	Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board
	KIM, YOUNG-WOO; RHEE, BYOUNG-HO; YANG, DEK-GIN; CHO, YOUNG-SANG; YIM, KYU-HYOK
	2004-06-10
著作权人	SAMSUNG ELECTRO-MECHANICS CO LTD
专利号	US20040109628A1
国家	美国
文献子类	发明申请
其他题名	Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board
英文摘要	Disclosed herein is an optical signal coupling block, and a multi-layer printed circuit board and the method for coupling optical signals between layers of a multi-layer printed circuit board (PCB) using optical signal coupling blocks. The optical signals between the layers are coupled through the steps of forming a plurality of optical via holes in the multi-layer PCB to which optical waveguides for transmitting optical signals are attached; inserting the optical signal coupling blocks into the plural optical via holes such that the optical signal coupling blocks are connected to the optical waveguides to transmit the optical signals; forming at least one connection part to couple optical signals between the optical waveguides and the optical signal coupling blocks; and interconnecting the optical waveguides and the optical signal coupling blocks by aligning positions of the optical waveguides and the optical signal coupling blocks.
公开日期	2004-06-10
申请日期	2003-04-16
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53000]
专题	半导体激光器专利数据库
作者单位	SAMSUNG ELECTRO-MECHANICS CO LTD
推荐引用方式 GB/T 7714	KIM, YOUNG-WOO,RHEE, BYOUNG-HO,YANG, DEK-GIN,et al. Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board. US20040109628A1. 2004-06-10.

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