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	TSV substrate with mirror and its application in high-speed optoelectronic packaging
	YU, FEI; DENG, QI
	2015-08-19
著作权人	HUAWEI TECHNOLOGIES CO., LTD.
专利号	EP2859394A4
国家	欧洲专利局
文献子类	发明申请
其他题名	TSV substrate with mirror and its application in high-speed optoelectronic packaging
英文摘要	One embodiment of the present invention provides a packaged optoelectronic module. The module includes a photonic chip having a top surface and a first substrate that includes a plurality of vias and a reflective surface. The photonic chip is flip-chip bonded to the first substrate with the top surface facing the first substrate. The vias facilitate electrical connections to the top surface, and the reflective surface forms an angle with the top surface, thereby enabling optical coupling between the top surface and an optical fiber placed in a direction that is substantially parallel to the top surface.
公开日期	2015-08-19
申请日期	2013-06-13
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/51705]
专题	半导体激光器专利数据库
作者单位	HUAWEI TECHNOLOGIES CO., LTD.
推荐引用方式 GB/T 7714	YU, FEI,DENG, QI. TSV substrate with mirror and its application in high-speed optoelectronic packaging. EP2859394A4. 2015-08-19.

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