Semiconductor light emitting device having effective cooling structure and method of manufacturing the same | |
KIM, KI-SUNG; LEE, JUN-HO | |
2006-08-10 | |
著作权人 | SAMSUNG ELECTRONICS CO., LTD. |
专利号 | US20060176924A1 |
国家 | 美国 |
文献子类 | 发明申请 |
其他题名 | Semiconductor light emitting device having effective cooling structure and method of manufacturing the same |
英文摘要 | A semiconductor light emitting device having a high heat emission efficiency and a method of manufacturing the same without reducing the light emission efficiency are provided. The semiconductor light emitting device includes a substrate, a thermal spreading layer formed on the substrate and patterned with predetermined gaps, a planarizing layer having a planarizing surface covering the thermal spreading layer, and a light emitting unit formed on the planarizing layer. |
公开日期 | 2006-08-10 |
申请日期 | 2006-02-02 |
状态 | 失效 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/51521] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | SAMSUNG ELECTRONICS CO., LTD. |
推荐引用方式 GB/T 7714 | KIM, KI-SUNG,LEE, JUN-HO. Semiconductor light emitting device having effective cooling structure and method of manufacturing the same. US20060176924A1. 2006-08-10. |
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