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	Device for and method of cutting with laser array
	BANGEL, DIETER
	2015-12-30
著作权人	GALLUS DRUCKMASCHINEN GMBH
专利号	EP2727680B1
国家	欧洲专利局
文献子类	授权发明
其他题名	Device for and method of cutting with laser array
英文摘要	The apparatus (10) has a transport device (5) for transporting a web or arcuate shaped substrate in a transport plane (E) in a transport direction (T). A laser cutting device (1) is arranged above or below the transport plane for processing the substrate, where a machine control unit (6) drives the transport device and the laser cutting device. The laser cutting device includes a laser array (2) having individually controllable vertical cavity surface emitting lasers extending across the width of the substrate. An independent claim is also included for a method for cutting and perforating a web or arcuate shaped substrate.
公开日期	2015-12-30
申请日期	2013-10-09
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/48630]
专题	半导体激光器专利数据库
作者单位	GALLUS DRUCKMASCHINEN GMBH
推荐引用方式 GB/T 7714	BANGEL, DIETER. Device for and method of cutting with laser array. EP2727680B1. 2015-12-30.

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