Layered semiconductor laser having solder laminations and method of making same | |
SEKI, AKINORI; OHNISHI, TOYOKAZU; NAKANO, JIRO; SUGIYAMA, TAKAHIDE; TOMITA, KAZUYOSHI; KANO, HIROYUKI | |
1997-02-18 | |
著作权人 | TOYOTA JIDOSHA KABUSHIKI KAISHA |
专利号 | US5604761 |
国家 | 美国 |
文献子类 | 授权发明 |
其他题名 | Layered semiconductor laser having solder laminations and method of making same |
英文摘要 | A semiconductor laser having a plurality of semiconductor laser chips laminated by solder layers which cause no interference with laser beams is provided. To this end, each of the semiconductor laser chips has a solder sump recess formed in the surface to be soldered at an end adjacent to a laser beam radiating surface and extending through portions of the chip except an active layer. This semiconductor laser is manufactured by a method comprising the steps of forming grooves in a surface of an epitaxial substrate along boundaries of semiconductor laser chip areas for defining laser beam radiating surfaces, each of the grooves extending through portions constituting the substrate except an active layer and having a bottom substantially parallel to the epitaxial substrate surface; cleaving the epitaxial substrate along the grooves to provide the semiconductor laser chips with laser beam radiating surfaces defined by the cleaved surfaces; and laminating the plurality of semiconductor laser chips one above another by soldering. |
公开日期 | 1997-02-18 |
申请日期 | 1994-10-14 |
状态 | 失效 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/46139] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | TOYOTA JIDOSHA KABUSHIKI KAISHA |
推荐引用方式 GB/T 7714 | SEKI, AKINORI,OHNISHI, TOYOKAZU,NAKANO, JIRO,et al. Layered semiconductor laser having solder laminations and method of making same. US5604761. 1997-02-18. |
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