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	Layered semiconductor laser having solder laminations and method of making same
	SEKI, AKINORI; OHNISHI, TOYOKAZU; NAKANO, JIRO; SUGIYAMA, TAKAHIDE; TOMITA, KAZUYOSHI; KANO, HIROYUKI
	1997-02-18
著作权人	TOYOTA JIDOSHA KABUSHIKI KAISHA
专利号	US5604761
国家	美国
文献子类	授权发明
其他题名	Layered semiconductor laser having solder laminations and method of making same
英文摘要	A semiconductor laser having a plurality of semiconductor laser chips laminated by solder layers which cause no interference with laser beams is provided. To this end, each of the semiconductor laser chips has a solder sump recess formed in the surface to be soldered at an end adjacent to a laser beam radiating surface and extending through portions of the chip except an active layer. This semiconductor laser is manufactured by a method comprising the steps of forming grooves in a surface of an epitaxial substrate along boundaries of semiconductor laser chip areas for defining laser beam radiating surfaces, each of the grooves extending through portions constituting the substrate except an active layer and having a bottom substantially parallel to the epitaxial substrate surface; cleaving the epitaxial substrate along the grooves to provide the semiconductor laser chips with laser beam radiating surfaces defined by the cleaved surfaces; and laminating the plurality of semiconductor laser chips one above another by soldering.
公开日期	1997-02-18
申请日期	1994-10-14
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/46139]
专题	半导体激光器专利数据库
作者单位	TOYOTA JIDOSHA KABUSHIKI KAISHA
推荐引用方式 GB/T 7714	SEKI, AKINORI,OHNISHI, TOYOKAZU,NAKANO, JIRO,et al. Layered semiconductor laser having solder laminations and method of making same. US5604761. 1997-02-18.

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