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	Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding
	MEDENDORP, NICHOLAS W.
著作权人	CREE, INC.
专利号	US20080191225A1
国家	美国
文献子类	发明申请
其他题名	Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding
英文摘要	Methods of packaging a semiconductor light emitting device include providing a substrate having the semiconductor light emitting device on a front face thereof and a contact on a front face thereof, wherein the light emitting device is electrically connected to the contact on the front face of the substrate. The substrate is compression molded to form an optical element on the front face of the substrate over the semiconductor light emitting device and a residual coating over a region of the front face of the substrate including the contact. The residual coating over the contact may be removed without damaging the contact. Packaged semiconductor light emitting devices are also provided.
公开日期	2008-08-14
申请日期	2007-02-12
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/43550]
专题	半导体激光器专利数据库
作者单位	CREE, INC.
推荐引用方式 GB/T 7714	MEDENDORP, NICHOLAS W.. Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding. US20080191225A1.

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