Method of fabricating a light emitting device, and light emitting device
SHINOHARA, MASAYUKI; YAMADA, MASATO
著作权人SHIN-ETSU HANDOTAI CO., LTD.
专利号US20040023426A1
国家美国
文献子类发明申请
其他题名Method of fabricating a light emitting device, and light emitting device
英文摘要In the fabricating of a light emitting device, a light emitting layer portion 24 and a current spreading layer 7, respectively composed of a Group III-V compound semiconductor, are stacked on a single crystal substrate. The light emitting layer portion 24 is formed by a metal organic vapor-phase epitaxy process, and the current spreading layer 7, on such light emitting layer portion 24, is formed to have conductivity type of n-type by a hydride vapor-phase epitaxy process.
公开日期2004-02-05
申请日期2003-07-28
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/43463]  
专题半导体激光器专利数据库
作者单位SHIN-ETSU HANDOTAI CO., LTD.
推荐引用方式
GB/T 7714
SHINOHARA, MASAYUKI,YAMADA, MASATO. Method of fabricating a light emitting device, and light emitting device. US20040023426A1.
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