| Electrical and flexural properties of copper and graphite filled phenolic resin composites | |
| Li, Midan; Niu, Huan; Wei, Shoubin; Yang, Hong | |
| 2012 | |
| 会议名称 | 2nd International Conference on Advances in Materials and Manufacturing, ICAMMP 2011 |
| 会议日期 | 2011-12-16 |
| 会议地点 | Guilin, China |
| 卷号 | 418-420 |
| 页码 | 1044-1047 |
| 收录类别 | EI |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/6579912 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Li, Midan,Niu, Huan,Wei, Shoubin,et al. Electrical and flexural properties of copper and graphite filled phenolic resin composites[C]. 见:2nd International Conference on Advances in Materials and Manufacturing, ICAMMP 2011. Guilin, China. 2011-12-16. |
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