Fabrication and characterization of TO packaged high-speed laser modules - art. no. 682407

CORC > 半导体研究所 > 中国科学院半导体研究所 > 中国科学院半导体研究所（2009年前）

	Fabrication and characterization of TO packaged high-speed laser modules - art. no. 682407
	Wen, JM ; Liu, Y ; Wang, X ; Yuan, HQ ; Xie, L ; Zhu, NH
	2008
会议名称	conference on semiconductor lasers and applications iii
会议日期	nov 12-13, 2007
会议地点	beijing, peoples r china
关键词	equivalent circuits FP laser modules DFB laser modules VCSEL modules Through hole (TO) packaging
页码	6824: 82407-82407
通讯作者	zhu, nh, chinese acad sci, inst semicond, state key lab integrated optoelect, pob 912, beijing 100083, peoples r china.
中文摘要	various high-speed laser modules are fabricated by to-packaged processes, such as fp laser modules, dfb laser modules, and vcsel modules. furthermore,, the resonance among the circuit elements provides an approach to compensating the to packaging parasitics, and improving the frequency response of the devices. the detailed equivalent circuit model is established to investigate both the laser diode and packaging comprehensively. the small-signal modulation bandwidths of the to packaged fp laser, dfb laser and the vcsel modules are more than 10, 9.7 and 8 ghz, respectively.
英文摘要	various high-speed laser modules are fabricated by to-packaged processes, such as fp laser modules, dfb laser modules, and vcsel modules. furthermore,, the resonance among the circuit elements provides an approach to compensating the to packaging parasitics, and improving the frequency response of the devices. the detailed equivalent circuit model is established to investigate both the laser diode and packaging comprehensively. the small-signal modulation bandwidths of the to packaged fp laser, dfb laser and the vcsel modules are more than 10, 9.7 and 8 ghz, respectively.; zhangdi于2010-03-09批量导入; made available in dspace on 2010-03-09t02:11:58z (gmt). no. of bitstreams: 1 708.pdf: 167655 bytes, checksum: 71bd2cb95b5456e40c92c1f5f5692e9e (md5) previous issue date: 2008; spie.; chinese opt soc.; [wen, ji min; liu, yu; wang, xin; yuan, hai qing; xie, liang; zhu, ning hua] chinese acad sci, inst semicond, state key lab integrated optoelect, beijing 100083, peoples r china
收录类别	CPCI-S
会议主办者	spie.; chinese opt soc.
会议录	semiconductor lasers and applications iii
会议录出版者	spie-int soc optical engineering ; 1000 20th st, po box 10, bellingham, wa 98227-0010 usa
会议录出版地	1000 20th st, po box 10, bellingham, wa 98227-0010 usa
学科主题	光电子学
语种	英语
ISSN号	0277-786x
ISBN号	978-0-8194-6999-1
内容类型	会议论文
源URL	[http://ir.semi.ac.cn/handle/172111/7854]
专题	半导体研究所_中国科学院半导体研究所（2009年前）
推荐引用方式 GB/T 7714	Wen, JM,Liu, Y,Wang, X,et al. Fabrication and characterization of TO packaged high-speed laser modules - art. no. 682407[C]. 见:conference on semiconductor lasers and applications iii. beijing, peoples r china. nov 12-13, 2007.