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	Thermal-Aware Task Scheduling in 3D Chip Multiprocessor with Real-Time Constrained Workloads
	Li, Jiayin; Qiu, Meikang; Niu, Jian-Wei; Yang, Laurence T.; Zhu, Yongxin; Ming, Zhong
刊名	ACM TRANSACTIONS ON EMBEDDED COMPUTING SYSTEMS
	2013
卷号	12
关键词	Algorithms Design Performance Thermal peak temperature task scheduling real-time constraint
ISSN号	1539-9087
DOI	10.1145/2423636.2423642
URL标识	查看原文
收录类别	SCIE ; EI
WOS记录号	WOS:000327432400006
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/6568739
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Li, Jiayin,Qiu, Meikang,Niu, Jian-Wei,et al. Thermal-Aware Task Scheduling in 3D Chip Multiprocessor with Real-Time Constrained Workloads[J]. ACM TRANSACTIONS ON EMBEDDED COMPUTING SYSTEMS,2013,12.
APA	Li, Jiayin,Qiu, Meikang,Niu, Jian-Wei,Yang, Laurence T.,Zhu, Yongxin,&Ming, Zhong.(2013).Thermal-Aware Task Scheduling in 3D Chip Multiprocessor with Real-Time Constrained Workloads.ACM TRANSACTIONS ON EMBEDDED COMPUTING SYSTEMS,12.
MLA	Li, Jiayin,et al."Thermal-Aware Task Scheduling in 3D Chip Multiprocessor with Real-Time Constrained Workloads".ACM TRANSACTIONS ON EMBEDDED COMPUTING SYSTEMS 12(2013).

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