| Numerical simulation of coupling heat transfer in sealed airborne electronic equipments | |
| Gao, Hongxia; Xiao, Zhan; Xie, Yongqi | |
| 2013 | |
| 会议名称 | International Conference on Applied Mechanics and Materials (ICAMM 2012) |
| 会议日期 | 2013-01-01 |
| 会议地点 | Sanya, PEOPLES R CHINA |
| 关键词 | airborne electronic equipment coupling heat transfer numerical simulation sealed |
| 卷号 | 275-277 |
| 页码 | 642-648 |
| 收录类别 | EI ; CPCI-S |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000320899900120 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/6563865 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Gao, Hongxia,Xiao, Zhan,Xie, Yongqi. Numerical simulation of coupling heat transfer in sealed airborne electronic equipments[C]. 见:International Conference on Applied Mechanics and Materials (ICAMM 2012). Sanya, PEOPLES R CHINA. 2013-01-01. |
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