| Effect of Ti content and Y additions on oxidation behavior of SnAgTi solder and its application on dissimilar metals soldering | |
| Qu, Wenqing; Zhou, Shuangshuang; Zhuang, Hongshou | |
| 刊名 | MATERIALS & DESIGN
 |
| 2015 | |
| 卷号 | 88页码:737-742 |
| 关键词 | SnAgTi solder Oxidation behavior Auger electron spectroscopy (AES) Dissimilar metal soldering |
| ISSN号 | 0261-3069 |
| DOI | 10.1016/j.matdes.2015.09.097 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE ; EI |
| WOS记录号 | WOS:000364257300087 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/6541617 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Qu, Wenqing,Zhou, Shuangshuang,Zhuang, Hongshou. Effect of Ti content and Y additions on oxidation behavior of SnAgTi solder and its application on dissimilar metals soldering[J]. MATERIALS & DESIGN,2015,88:737-742. |
| APA | Qu, Wenqing,Zhou, Shuangshuang,&Zhuang, Hongshou.(2015).Effect of Ti content and Y additions on oxidation behavior of SnAgTi solder and its application on dissimilar metals soldering.MATERIALS & DESIGN,88,737-742. |
| MLA | Qu, Wenqing,et al."Effect of Ti content and Y additions on oxidation behavior of SnAgTi solder and its application on dissimilar metals soldering".MATERIALS & DESIGN 88(2015):737-742. |
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