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	Thermal analysis of susceptor with Rim structure in MOCVD with the chipped infrared heating system
	Hu, Shi-gang; Hu, Ying-Lu; Wu, Xiao-Feng; Xi, Zai-fang
刊名	International Journal of Advancements in Computing Technology
	2012
卷号	Vol.4 No.17页码:220-227
ISSN号	2005-8039;2233-9337
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/6508400
专题	湖南大学
作者单位	1.School of Information and Electrical Engineering, Hunan University of Science and Technology, Xiangtan 411201, China 2.School of Technical Physics, Xidian University, Xi'an 710071, China
推荐引用方式 GB/T 7714	Hu, Shi-gang,Hu, Ying-Lu,Wu, Xiao-Feng,et al. Thermal analysis of susceptor with Rim structure in MOCVD with the chipped infrared heating system[J]. International Journal of Advancements in Computing Technology,2012,Vol.4 No.17:220-227.
APA	Hu, Shi-gang,Hu, Ying-Lu,Wu, Xiao-Feng,&Xi, Zai-fang.(2012).Thermal analysis of susceptor with Rim structure in MOCVD with the chipped infrared heating system.International Journal of Advancements in Computing Technology,Vol.4 No.17,220-227.
MLA	Hu, Shi-gang,et al."Thermal analysis of susceptor with Rim structure in MOCVD with the chipped infrared heating system".International Journal of Advancements in Computing Technology Vol.4 No.17(2012):220-227.

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