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	Simulation study of effect of initial melt temperature on microstructure evolution of liquid metal Ni during solidfication process
	Deng, Yang; Liu, Rang-Su; Zhou, Qun-Yi; Liu, Hai-Rong; Liang, Yong-Chao; Mo, Yun-Fei; Zhang, Hai-Tao; Tian, Ze-An; Peng, Ping
刊名	ACTA PHYSICA SINICA
	2013
卷号	Vol.62 No.16
关键词	liquid metal Ni initial melt temperature microstructure molecular dynamics simulation
ISSN号	1000-3290
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/6497740
专题	湖南大学
作者单位	1.School of Physics and Microelectronics Science, Hunan University, Changsha 410082, China 2.College of Materials Science and Engineering, Hunan University, Changsha 410082, China
推荐引用方式 GB/T 7714	Deng, Yang,Liu, Rang-Su,Zhou, Qun-Yi,et al. Simulation study of effect of initial melt temperature on microstructure evolution of liquid metal Ni during solidfication process[J]. ACTA PHYSICA SINICA,2013,Vol.62 No.16.
APA	Deng, Yang.,Liu, Rang-Su.,Zhou, Qun-Yi.,Liu, Hai-Rong.,Liang, Yong-Chao.,...&Peng, Ping.(2013).Simulation study of effect of initial melt temperature on microstructure evolution of liquid metal Ni during solidfication process.ACTA PHYSICA SINICA,Vol.62 No.16.
MLA	Deng, Yang,et al."Simulation study of effect of initial melt temperature on microstructure evolution of liquid metal Ni during solidfication process".ACTA PHYSICA SINICA Vol.62 No.16(2013).

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