Novel efficient compact package of high power laser diode arrays with single piece copper micro-channel heatsink cooling

	Novel efficient compact package of high power laser diode arrays with single piece copper micro-channel heatsink cooling
	Liu Y. ; Liao X. S. ; Tang Y. X. ; Yao S. ; Cheng D. M.
	2004
会议日期	2004
页码	429-433
收录类别	CPCI-S
会议录	Proceedings of the Society of Photo-Optical Instrumentation Engineers (Spie)
会议录出版者	Spie-Int Soc Optical Engineering
会议录出版地	Bellingham
语种	英语
ISBN号	0277-786X 0-8194-5175-4
内容类型	会议论文
源URL	[http://ir.ciomp.ac.cn/handle/181722/34882]
专题	长春光学精密机械与物理研究所_中科院长春光机所知识产出_会议论文
推荐引用方式 GB/T 7714	Liu Y.,Liao X. S.,Tang Y. X.,et al. Novel efficient compact package of high power laser diode arrays with single piece copper micro-channel heatsink cooling[C]. 见:. 2004.