| Solder joint imagery compressing and recovery based on compressive sensing | |
| Zhao, Huihuang; Gu, Haicheng; Qiao, Zhijun | |
| 会议名称 | Compressive Sensing III |
| 会议日期 | 2014 |
| 会议地点 | Baltimore, MD, United states |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/6098309 |
| 专题 | 湖南大学 |
| 作者单位 | 1.College of Electrical and Information Engineering, Hunan University, Hunan 2.410082, China 3.Department of Mathematics, University of Texas-Pan American, Edinburg 4.IL 5.78539, United States |
| 推荐引用方式 GB/T 7714 | Zhao, Huihuang,Gu, Haicheng,Qiao, Zhijun. Solder joint imagery compressing and recovery based on compressive sensing[C]. 见:Compressive Sensing III. Baltimore, MD, United states. 2014. |
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