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	Signal integrity simulation design of image processor PCB combined with electromagnetic compatibility analyses based on altium designer 6 (EI CONFERENCE)
	Cheng Y. Q. ; Zhu M. ; Ge W.
	2009
会议名称	2009 4th IEEE Conference on Industrial Electronics and Applications, ICIEA 2009, May 25, 2009 - May 27, 2009
会议地点	Xi'an, China
关键词	With the coming of the high-speed digital system age signal integrity (SI) and electromagnetic compatibility (EMC) should not be ignored any more. In this paper based on basic theories of SI and EMC the high-speed digital design method for PCB using the SI simulation tool of Altium Designer 6 and EMC analyses is introduced and the impedance control power integrity (PI) design and SI (reflections and crosstalk) design of a piece of image processor PCB are demonstrated in detail. The simulation results show that the impedance control is perfect reasonable termination can improve the waveforms and control the reflections and crosstalk. 2009 IEEE.
页码	745-749
收录类别	EI
内容类型	会议论文
源URL	[http://ir.ciomp.ac.cn/handle/181722/33525]
专题	长春光学精密机械与物理研究所_中科院长春光机所知识产出_会议论文
推荐引用方式 GB/T 7714	Cheng Y. Q.,Zhu M.,Ge W.. Signal integrity simulation design of image processor PCB combined with electromagnetic compatibility analyses based on altium designer 6 (EI CONFERENCE)[C]. 见:2009 4th IEEE Conference on Industrial Electronics and Applications, ICIEA 2009, May 25, 2009 - May 27, 2009. Xi'an, China.

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