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	Analysis and Optimization of Temperature Field in Pulp Molding Mold Heating Plate Based on Ansys
	Hua Guangjun; Liao Zeshun; Xie Yong; Mo Canliang
刊名	Packaging Engineering
	2016
卷号	Vol.37 No.1页码:78-82
关键词	Ansys heating plate channel Ansys temperature field
ISSN号	1001-3563
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/6073029
专题	湖南大学
推荐引用方式 GB/T 7714	Hua Guangjun,Liao Zeshun,Xie Yong,et al. Analysis and Optimization of Temperature Field in Pulp Molding Mold Heating Plate Based on Ansys[J]. Packaging Engineering,2016,Vol.37 No.1:78-82.
APA	Hua Guangjun,Liao Zeshun,Xie Yong,&Mo Canliang.(2016).Analysis and Optimization of Temperature Field in Pulp Molding Mold Heating Plate Based on Ansys.Packaging Engineering,Vol.37 No.1,78-82.
MLA	Hua Guangjun,et al."Analysis and Optimization of Temperature Field in Pulp Molding Mold Heating Plate Based on Ansys".Packaging Engineering Vol.37 No.1(2016):78-82.

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