| Molecular dynamics simulation of the propagation property of the interface micro crack in ternary boride hard cladding material | |
| Yang, Jun Ru; Guo, Kun; Chi, Yu Rong; Chen, Xue Cheng; Feng, Hai Tao | |
| 2016 | |
| 会议名称 | 12th Asia-Pacific Conference on Materials Processing, APCMP2016 |
| 会议日期 | June 16, 2016 - June 19, 2016 |
| 卷号 | 861 |
| DOI | 10.4028/www.scientific.net/MSF.861.264 |
| 页码 | 264-269 |
| 收录类别 | EI |
| 会议录 | Materials Science Forum
 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/6031900 |
| 专题 | 山东大学 |
| 作者单位 | College of Mechanical and Electronic Engineering, Shandong University of Scien |
| 推荐引用方式 GB/T 7714 | Yang, Jun Ru,Guo, Kun,Chi, Yu Rong,et al. Molecular dynamics simulation of the propagation property of the interface micro crack in ternary boride hard cladding material[C]. 见:12th Asia-Pacific Conference on Materials Processing, APCMP2016. June 16, 2016 - June 19, 2016. |
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