| Influence of temperature on pumping rate and crystalline grain of copper filler in through-silicon vias | |
| Pan, Xiaoxu; Huang, Pengfei; Su, Fei; Guan, Yong; Ma, Shenglin; Chen, Jing | |
| 2016 | |
| 会议名称 | 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
| 会议日期 | 2016-01-01 |
| 关键词 | Through-Silicon Vias (TSV) Copper pumping Pumping rate In-situ observation Stress crystalline grain |
| 页码 | 1280-1283 |
| 收录类别 | CPCI-S |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000389835800280 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5957183 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Pan, Xiaoxu,Huang, Pengfei,Su, Fei,et al. Influence of temperature on pumping rate and crystalline grain of copper filler in through-silicon vias[C]. 见:2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2016-01-01. |
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