| Research on Test Method of Thermal Contact Resistance between Film/Structure | |
| Wei, Wei; Zhang, Weifang; Jin, Xiaoshuai; Wang, Hongxun | |
| 2016 | |
| 会议名称 | International Conference on Mechanical Manufacturing and Energy Engineering (ICMMEE) |
| 会议地点 | Changsha, PEOPLES R CHINA |
| 页码 | 98-103 |
| 收录类别 | CPCI-S |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000390842800019 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5951843 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Wei, Wei,Zhang, Weifang,Jin, Xiaoshuai,et al. Research on Test Method of Thermal Contact Resistance between Film/Structure[C]. 见:International Conference on Mechanical Manufacturing and Energy Engineering (ICMMEE). Changsha, PEOPLES R CHINA. |
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