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	Effects of deep reactive ion etching parameters on etching rate and surface morphology in extremely deep silicon etch process with high aspect ratio
	Xu, Tiantong; Tao, Zhi; Li, Hanqing; Tan, Xiao; Li, Haiwang
刊名	ADVANCES IN MECHANICAL ENGINEERING
	2017
卷号	9
关键词	High-aspect-ratio silicon etch surface morphology silicon etch rate deep reactive ion etching empirical function formula
ISSN号	1687-8140
DOI	10.1177/1687814017738152
URL标识	查看原文
收录类别	SCIE
WOS记录号	WOS:000418170100001
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5946799
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Xu, Tiantong,Tao, Zhi,Li, Hanqing,et al. Effects of deep reactive ion etching parameters on etching rate and surface morphology in extremely deep silicon etch process with high aspect ratio[J]. ADVANCES IN MECHANICAL ENGINEERING,2017,9.
APA	Xu, Tiantong,Tao, Zhi,Li, Hanqing,Tan, Xiao,&Li, Haiwang.(2017).Effects of deep reactive ion etching parameters on etching rate and surface morphology in extremely deep silicon etch process with high aspect ratio.ADVANCES IN MECHANICAL ENGINEERING,9.
MLA	Xu, Tiantong,et al."Effects of deep reactive ion etching parameters on etching rate and surface morphology in extremely deep silicon etch process with high aspect ratio".ADVANCES IN MECHANICAL ENGINEERING 9(2017).

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