| Solder joint failure localization of welded joint based on acoustic emission beamforming | |
| Liu, Xiandong; Xiao, Denghong; Shan, Yingchun; Pan, Qiang; He, Tian; Gao, Yong | |
| 刊名 | ULTRASONICS
 |
| 2017 | |
| 卷号 | 74页码:221-232 |
| 关键词 | Localization Welded joint Acoustic emission Beamforming Wavelet packet transform |
| ISSN号 | 0041-624X |
| DOI | 10.1016/j.ultras.2016.11.002 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE ; EI ; PUBMED |
| WOS记录号 | WOS:000390516800023 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5942621 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Liu, Xiandong,Xiao, Denghong,Shan, Yingchun,et al. Solder joint failure localization of welded joint based on acoustic emission beamforming[J]. ULTRASONICS,2017,74:221-232. |
| APA | Liu, Xiandong,Xiao, Denghong,Shan, Yingchun,Pan, Qiang,He, Tian,&Gao, Yong.(2017).Solder joint failure localization of welded joint based on acoustic emission beamforming.ULTRASONICS,74,221-232. |
| MLA | Liu, Xiandong,et al."Solder joint failure localization of welded joint based on acoustic emission beamforming".ULTRASONICS 74(2017):221-232. |
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