| Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor | |
| Li, Haiwang; Liu, Jiasi; Xu, Tiantong; Xia, Jingchao; Tan, Xiao; Tao, Zhi | |
| 刊名 | MICROMACHINES
 |
| 2018 | |
| 卷号 | 9 |
| 关键词 | through-silicon-vias (TSV) high aspect ratio control variable method electroplating three-dimensional (3D) inductor |
| ISSN号 | 2072-666X |
| DOI | 10.3390/mi9100528 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE ; PUBMED |
| WOS记录号 | WOS:000448554800054 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5929741 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Li, Haiwang,Liu, Jiasi,Xu, Tiantong,et al. Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor[J]. MICROMACHINES,2018,9. |
| APA | Li, Haiwang,Liu, Jiasi,Xu, Tiantong,Xia, Jingchao,Tan, Xiao,&Tao, Zhi.(2018).Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor.MICROMACHINES,9. |
| MLA | Li, Haiwang,et al."Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor".MICROMACHINES 9(2018). |
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