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	A physically based model for correlating the microstructural degradation and residual creep lifetime of a polycrystalline Ni-based superalloy
	Li, Shaolin; Wang, Bingxue; Shi, Duoqi; Yang, Xiaoguang; Qi, Hongyu
刊名	JOURNAL OF ALLOYS AND COMPOUNDS
	2019
卷号	783页码:565-573
关键词	Microstructure evolution Lifetime degradation K417 alloy Creep-rupture time Analytical model
ISSN号	0925-8388
DOI	10.1016/j.jallcom.2018.11.417
URL标识	查看原文
收录类别	SCIE ; EI
WOS记录号	WOS:000458872600066
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5922392
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Li, Shaolin,Wang, Bingxue,Shi, Duoqi,et al. A physically based model for correlating the microstructural degradation and residual creep lifetime of a polycrystalline Ni-based superalloy[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2019,783:565-573.
APA	Li, Shaolin,Wang, Bingxue,Shi, Duoqi,Yang, Xiaoguang,&Qi, Hongyu.(2019).A physically based model for correlating the microstructural degradation and residual creep lifetime of a polycrystalline Ni-based superalloy.JOURNAL OF ALLOYS AND COMPOUNDS,783,565-573.
MLA	Li, Shaolin,et al."A physically based model for correlating the microstructural degradation and residual creep lifetime of a polycrystalline Ni-based superalloy".JOURNAL OF ALLOYS AND COMPOUNDS 783(2019):565-573.

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