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High-Throughput Platform for Efficient Chemical Transfection, Virus Packaging, and Transduction
Zhang, Jianxiong; Hu, Yawei; Wang, Xiaoqing; Liu, Peng; Chen, Xiaofang
刊名MICROMACHINES
2019
卷号10
关键词high throughput gene delivery transfection virus packaging transduction SMAR-chip
ISSN号2072-666X
DOI10.3390/mi10060387
URL标识查看原文
收录类别SCIE ; EI ; PUBMED
WOS记录号WOS:000475350100039
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/5918962
专题北京航空航天大学
推荐引用方式
GB/T 7714
Zhang, Jianxiong,Hu, Yawei,Wang, Xiaoqing,et al. High-Throughput Platform for Efficient Chemical Transfection, Virus Packaging, and Transduction[J]. MICROMACHINES,2019,10.
APA Zhang, Jianxiong,Hu, Yawei,Wang, Xiaoqing,Liu, Peng,&Chen, Xiaofang.(2019).High-Throughput Platform for Efficient Chemical Transfection, Virus Packaging, and Transduction.MICROMACHINES,10.
MLA Zhang, Jianxiong,et al."High-Throughput Platform for Efficient Chemical Transfection, Virus Packaging, and Transduction".MICROMACHINES 10(2019).
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