| Influence of Thermal Aging on Microstructure and Property of Gold Alloy Joint Soldered by Sn-based Solder | |
| Mu, Guoqian; Qu, Wenqing; Lv, Xixiao; Zhuang, Hongshou | |
| 2019 | |
| 会议名称 | 2018 International Conference on Advanced Welding and Smart Fabrication Technologies, IIW 2018 |
| 会议日期 | 2018-07-15 |
| 会议地点 | Bali, Indonesia |
| 卷号 | 269 |
| 收录类别 | EI |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5918753 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Mu, Guoqian,Qu, Wenqing,Lv, Xixiao,et al. Influence of Thermal Aging on Microstructure and Property of Gold Alloy Joint Soldered by Sn-based Solder[C]. 见:2018 International Conference on Advanced Welding and Smart Fabrication Technologies, IIW 2018. Bali, Indonesia. 2018-07-15. |
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