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	Theoretical and experimental investigations of transient thermo-mechanical analysis on flexible electronic devices
	Zhang, Jianpeng; Li, Yuhang; Xing, Yufeng
刊名	INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
	2019
卷号	160页码:192-199
关键词	Flexible electronic devices Transient thermo-mechanical analysis Transfer matrix method
ISSN号	0020-7403
DOI	10.1016/j.ijmecsci.2019.04.041
URL标识	查看原文
收录类别	SCIE ; EI
WOS记录号	WOS:000485209700016
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5918607
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Zhang, Jianpeng,Li, Yuhang,Xing, Yufeng. Theoretical and experimental investigations of transient thermo-mechanical analysis on flexible electronic devices[J]. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES,2019,160:192-199.
APA	Zhang, Jianpeng,Li, Yuhang,&Xing, Yufeng.(2019).Theoretical and experimental investigations of transient thermo-mechanical analysis on flexible electronic devices.INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES,160,192-199.
MLA	Zhang, Jianpeng,et al."Theoretical and experimental investigations of transient thermo-mechanical analysis on flexible electronic devices".INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES 160(2019):192-199.

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