| Effect of solder and barrier layer elements on the thermoelectric properties of Bi0.5Sb1.5Te3 | |
| Mi, Hong-Xing; Wu, Ming-Xing; Cao, Shen; Huang, Zhong-Yue; Han, Li; Xu, Ju | |
| 刊名 | MATERIALS RESEARCH EXPRESS
 |
| 2019 | |
| 卷号 | 6 |
| 关键词 | solder barrier layer bismuth antimony telluride thermoelectric property |
| ISSN号 | 2053-1591 |
| DOI | 10.1088/2053-1591/ab3cd5 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE ; EI |
| WOS记录号 | WOS:000484138300002 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5916563 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Mi, Hong-Xing,Wu, Ming-Xing,Cao, Shen,et al. Effect of solder and barrier layer elements on the thermoelectric properties of Bi0.5Sb1.5Te3[J]. MATERIALS RESEARCH EXPRESS,2019,6. |
| APA | Mi, Hong-Xing,Wu, Ming-Xing,Cao, Shen,Huang, Zhong-Yue,Han, Li,&Xu, Ju.(2019).Effect of solder and barrier layer elements on the thermoelectric properties of Bi0.5Sb1.5Te3.MATERIALS RESEARCH EXPRESS,6. |
| MLA | Mi, Hong-Xing,et al."Effect of solder and barrier layer elements on the thermoelectric properties of Bi0.5Sb1.5Te3".MATERIALS RESEARCH EXPRESS 6(2019). |
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