| Curing dynamics of soy flour-based adhesives enhanced by waterborne polyurethane | |
| Wang, Yong; Li, Xianjun; Lou, Wanli; Deng, Layun; Fan, Youhua* | |
| 刊名 | International Journal of Polymer Science
 |
| 2019 | |
| 卷号 | 2019 |
| ISSN号 | 1687-9422 |
| DOI | 10.1155/2019/2916759 |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000458415200001 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5735655 |
| 专题 | 中南林业科技大学 |
| 作者单位 | 1.[Deng, Layun 2.Fan, Youhua 3.Wang, Yong] Hunan Acad Forestry, Key Lab, State Forestry Adm Utilizat Sci Southern Woody Oi, Changsha, Hunan, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Wang, Yong,Li, Xianjun,Lou, Wanli,et al. Curing dynamics of soy flour-based adhesives enhanced by waterborne polyurethane[J]. International Journal of Polymer Science,2019,2019. |
| APA | Wang, Yong,Li, Xianjun,Lou, Wanli,Deng, Layun,&Fan, Youhua*.(2019).Curing dynamics of soy flour-based adhesives enhanced by waterborne polyurethane.International Journal of Polymer Science,2019. |
| MLA | Wang, Yong,et al."Curing dynamics of soy flour-based adhesives enhanced by waterborne polyurethane".International Journal of Polymer Science 2019(2019). |
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