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	Time-based reflow soldering optimization by using adaptive Kriging-HDMR method
	Chen, Liming; Li, Enying*; Wang, Hu*
刊名	Soldering and Surface Mount Technology
	2016
卷号	28期号:2页码:101-113
关键词	Kriging Reflow soldering Warpage Expected improvement High dimensional representation modal
ISSN号	0954-0911
DOI	10.1108/SSMT-07-2015-0021
URL标识	查看原文
WOS记录号	WOS:000376207000006;EI:20161802313591
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5727300
专题	中南林业科技大学
作者单位	1.[Wang, Hu 2.Chen, Liming] Hunan Univ, State Key Lab Adv Design & Mfg Vehicle Body, Changsha 410082, Hunan, Peoples R China.
推荐引用方式 GB/T 7714	Chen, Liming,Li, Enying*,Wang, Hu*. Time-based reflow soldering optimization by using adaptive Kriging-HDMR method[J]. Soldering and Surface Mount Technology,2016,28(2):101-113.
APA	Chen, Liming,Li, Enying*,&Wang, Hu*.(2016).Time-based reflow soldering optimization by using adaptive Kriging-HDMR method.Soldering and Surface Mount Technology,28(2),101-113.
MLA	Chen, Liming,et al."Time-based reflow soldering optimization by using adaptive Kriging-HDMR method".Soldering and Surface Mount Technology 28.2(2016):101-113.

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