| Fabrication of microfluidic chip using two substrates with different Tg temperature | |
| Xu, M.; Luo, Y.; Wang, X. D.; Liu, C. | |
| 2006 | |
| 会议名称 | 9th International Symposium on Advances in Abrasive Technology |
| 会议日期 | 2006-09-26 |
| 会议地点 | Dalian, PEOPLES R CHINA |
| 关键词 | hot embossing bonding microfluidic chip PMMA COP |
| 页码 | 301-306 |
| 会议录 | 9th International Symposium on Advances in Abrasive Technology
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| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5700802 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, Key Lab Precis & Nontradit Machining Minist Educ, Dalian, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Xu, M.,Luo, Y.,Wang, X. D.,et al. Fabrication of microfluidic chip using two substrates with different Tg temperature[C]. 见:9th International Symposium on Advances in Abrasive Technology. Dalian, PEOPLES R CHINA. 2006-09-26. |
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