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Thermal stress analysis for laminated plates using actual temperature field
Wu, Zhen; Cheng, Y. K.; Lo, S. H.; Chen, Wanji
刊名INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
2007
卷号49页码:1276-1288
关键词global-local higher order model laminated composite plates actual temperature fields finite elements
ISSN号0020-7403
URL标识查看原文
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/5670245
专题大连理工大学
作者单位1.Dalian Univ Technol, State Key Lab Struct Anal Ind Aquipment, Dalian, Peoples R China.
2.Univ Hong Kong, Dept Civil Engn, Hong Kong, Peoples R China.
推荐引用方式
GB/T 7714
Wu, Zhen,Cheng, Y. K.,Lo, S. H.,et al. Thermal stress analysis for laminated plates using actual temperature field[J]. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES,2007,49:1276-1288.
APA Wu, Zhen,Cheng, Y. K.,Lo, S. H.,&Chen, Wanji.(2007).Thermal stress analysis for laminated plates using actual temperature field.INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES,49,1276-1288.
MLA Wu, Zhen,et al."Thermal stress analysis for laminated plates using actual temperature field".INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES 49(2007):1276-1288.
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