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	Large-sized diamond wafer polishing method, involves utilizing thermoelectric couple and external electrical heating temperature regulating device to detect and control local temperature in processing region.
	JIN Z YUAN Z KANG R DONG B
	2008
公开日期	2008-11-12
URL标识	查看原文
申请日期	2008-07-03
内容类型	专利
URI标识	http://www.corc.org.cn/handle/1471x/5613796
专题	大连理工大学
作者单位	UNIV DALIAN TECHNOLOGY UNIV DALIAN TECHNOLOGY (UYDA-C
推荐引用方式 GB/T 7714	JIN Z YUAN Z KANG R DONG B. Large-sized diamond wafer polishing method, involves utilizing thermoelectric couple and external electrical heating temperature regulating device to detect and control local temperature in processing region.. 2008-01-01.

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