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	Dielectric properties of epoxy nanocomposites filled with copper oxides
	Yang, Wenhu[1,2,3]; Liao, Wei-Hsin[2]; Yu, Shuhui[4]; Sun, Rong[4]
	AUG 16-19, 2017
会议日期	AUG 16-19, 2017
会议地点	IEEE, Harbin, PEOPLES R CHINA
会议录	18th International Conference on Electronic Packaging Technology (ICEPT)
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/5513990
专题	广东海洋大学
作者单位	1.[1]Guangdong Ocean Univ, Sch Elect & Informat Engn, Zhanjiang 524088, Peoples R China 2.[2]Chinese Univ Hong Kong, Dept Mech & Automat Engn, Shatin, Hong Kong, Peoples R China 3.[3]Guangdong Ocean Univ, Shenzhen Res Inst, Shenzhen 518120, Peoples R China 4.[4]Chinese Acad Sci, Shenzhen Inst Adv Technol, Ctr Adv Mat, Shenzhen 518055, Peoples R China
推荐引用方式 GB/T 7714	Yang, Wenhu[1,2,3],Liao, Wei-Hsin[2],Yu, Shuhui[4],et al. Dielectric properties of epoxy nanocomposites filled with copper oxides[C]. 见:. IEEE, Harbin, PEOPLES R CHINA. AUG 16-19, 2017.

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