Dielectric properties of epoxy nanocomposites filled with copper oxides | |
Yang, Wenhu[1,2,3]; Liao, Wei-Hsin[2]; Yu, Shuhui[4]; Sun, Rong[4] | |
AUG 16-19, 2017 | |
会议日期 | AUG 16-19, 2017 |
会议地点 | IEEE, Harbin, PEOPLES R CHINA |
会议录 | 18th International Conference on Electronic Packaging Technology (ICEPT)
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URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/5513990 |
专题 | 广东海洋大学 |
作者单位 | 1.[1]Guangdong Ocean Univ, Sch Elect & Informat Engn, Zhanjiang 524088, Peoples R China 2.[2]Chinese Univ Hong Kong, Dept Mech & Automat Engn, Shatin, Hong Kong, Peoples R China 3.[3]Guangdong Ocean Univ, Shenzhen Res Inst, Shenzhen 518120, Peoples R China 4.[4]Chinese Acad Sci, Shenzhen Inst Adv Technol, Ctr Adv Mat, Shenzhen 518055, Peoples R China |
推荐引用方式 GB/T 7714 | Yang, Wenhu[1,2,3],Liao, Wei-Hsin[2],Yu, Shuhui[4],et al. Dielectric properties of epoxy nanocomposites filled with copper oxides[C]. 见:. IEEE, Harbin, PEOPLES R CHINA. AUG 16-19, 2017. |
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