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	Study on Grind-Hardening Temperature Field Based on Infrared Temperature Measurement and Numerical Simulation
	Zhang, Zhenguo; Ge, Peiqi; Zhang, Lei; Tian, Maocheng
刊名	ADVANCES IN MATERIALS PROCESSING IX
	2010
卷号	443页码:394-399
关键词	Grind-hardening Temperature field Infrared temperature measurement Simulation
DOI	10.4028/www.scientific.net/KEM.443.394
会议名称	9th Asia-Pacific Conference on Materials Processing
URL标识	查看原文
会议日期	JUN 07-10, 2010
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5513536
专题	山东大学
作者单位	Shandong Univ, Sch Mech Engn, Minist Educ, Key Lab High Efficiency & Clean Mech Mfg, Jinan 250
推荐引用方式 GB/T 7714	Zhang, Zhenguo,Ge, Peiqi,Zhang, Lei,et al. Study on Grind-Hardening Temperature Field Based on Infrared Temperature Measurement and Numerical Simulation[J]. ADVANCES IN MATERIALS PROCESSING IX,2010,443:394-399.
APA	Zhang, Zhenguo,Ge, Peiqi,Zhang, Lei,&Tian, Maocheng.(2010).Study on Grind-Hardening Temperature Field Based on Infrared Temperature Measurement and Numerical Simulation.ADVANCES IN MATERIALS PROCESSING IX,443,394-399.
MLA	Zhang, Zhenguo,et al."Study on Grind-Hardening Temperature Field Based on Infrared Temperature Measurement and Numerical Simulation".ADVANCES IN MATERIALS PROCESSING IX 443(2010):394-399.

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